Shares of Texas Instruments Incorporated (NASDAQ:TXN) ended Friday session in green amid volatile trading. The shares closed up +0.14 points or 0.20% at $69.36 with 6.51 million shares getting traded. Post opening the session at $69.97, the shares hit an intraday low of $68.48 and an intraday high of $69.97 and the price vacillated in this range throughout the day. The company has a market cap of $69.08 billion and the numbers of outstanding shares have been calculated to be 1.00 billion shares.
On Sept. 14, 2016 Expanding the functionality of Internet of Things (IoT) networks, Texas Instruments (TI) (TXN) announced availability for mass production of the industry’s lowest-power dual-band wireless microcontroller (MCU) supporting Sub-1 GHz and Bluetooth® low energy connectivity on a single chip. As part of TI’s pin-to-pin and software compatible SimpleLink™ ultra-low power platform, the new SimpleLink dual-band CC1350 wireless MCU enables developers to move from a three-chip solution to a tiny single chip, while reducing design complexity, saving power, cost and board space. The CC1350 wireless MCU offers a range of up to 20 km on a coin cell battery for building and factory automation, alarm and security, smart grid, asset tracking and wireless sensor network applications. For more information, visit www.ti.com/cc1350-pr.
Designed for low-power wide area networks (LPWAN), the CC1350 wireless MCU features:
Dual-band connectivity that expands the functionality of a Sub-1 GHz network with Bluetooth low energy implementations such as beaconing, over-the-air updates, smart commissioning, remote displays and more.
Long-range connectivity paired with ultra-low power consumption that offers a sleep current of 0.7 uA which allows for more than 10 years of battery life.
Enhanced integration in a tiny wireless MCU that combines a Sub-1 GHz transceiver and Bluetooth low energy radio, as well as an ARM® Cortex®-M3 core in a single, Flash-based, 4×4 mm QFN package.
Developers can get started in minutes with the low-cost SimpleLink CC1350 wireless MCU LaunchPad™ development kit or connect sensors to the cloud in minutes with the SimpleLink CC1350 SensorTag demo kit supported by TI’s Code Composer Studio™ integrated development environment (IDE) and IAR Embedded WorkBench®. Additionally, TI has simplified development by providing multiple software options including point-to-point communication examples with EasyLink, a wireless M-Bus protocol stack leveraging TI RTOS, as well as the BLE-Stack 2.2 software development kit (SDK) which supports Bluetooth 4.2 specifications. Developers will also have access to online training and E2E™ community support to help ease their design process.
Shares of International Business Machines Corp. (NYSE:IBM) ended Friday session in red amid volatile trading. The shares closed down -1.82 points or -1.17% at $153.84 with 6.46 million shares getting traded. Post opening the session at $155.04, the shares hit an intraday low of $153.47 and an intraday high of $155.40 and the price vacillated in this range throughout the day. The company has a market cap of $144.74 billion and the numbers of outstanding shares have been calculated to be 955.84 million shares.
On Sept. 16, 2016 International Business Machines Corp. (IBM) and JFE Steel Co., Ltd., signed a five-year outsourcing agreement enabling the steel company to migrate core systems to the IBM Cloud while consolidating its IT infrastructure and streamlining its business operations.
With the World Steel Organization stating that steel prices will continue to fall in 2016, steel companies like JFE Steel, must identify ways of creating a more efficient business model that can quickly adjust to market changes. In fact, under the JFE Group’s medium-term business plan, JFE Steel aims to increase annual JFE branded product and services to 40 million tons.
“To ensure we are aligned with our global business strategy, we needed a flexible IT infrastructure with the scalability and speed,” said Akira Nitta, Executive Assistant General Manager, IT Innovation Leading Department, JFE Steel Corporation. “By taking advantage of the IBM Cloud, we are able to promote the business transformation, continue to provide value for clients and focus on becoming a global steel supplier.”