Shares of Crown Castle International Corp (NYSE:CCI) ended Friday session in red amid volatile trading. The shares closed down -1.09 points or -1.19% at $90.37 with 3.93 million shares getting traded. Post opening the session at $91.13, the shares hit an intraday low of $89.82 and an intraday high of $91.27 and the price vacillated in this range throughout the day. The company has a market cap of $30.51 billion and the numbers of outstanding shares have been calculated to be 337.56 million shares.
Crown Castle International Corp (CCI) announced that Dan Schlanger, Crown Castle’s Chief Financial Officer, is scheduled to present on Wednesday, September 21, 2016 at 1:15 p.m. Eastern Time at the Goldman Sachs 25th Annual Communacopia Conference. Mr. Schlanger’s presentation will be broadcast live over the Internet and is expected to last approximately 45 minutes. The live audio webcast link and presentation for the conference will be available on Crown Castle’s website at http://www.crowncastle.com, where it will also be archived for replay.
Shares of NXP Semiconductors NV (NASDAQ:NXPI) ended Friday session in red amid volatile trading. The shares closed down -1.79 points or -2.09% at $83.75 with 3.92 million shares getting traded. Post opening the session at $85.87, the shares hit an intraday low of $83.45 and an intraday high of $86.23 and the price vacillated in this range throughout the day. The company has a market cap of $28.37 billion and the numbers of outstanding shares have been calculated to be 339.21 million shares.
On Sept. 01, 2016 NXP Semiconductors N.V. (NXPI) in collaboration with Midea, the world’s major consumer household appliance manufacturer in China, unveiled a smart kitchen appliance using semiconductor microwave heating technologies. Combined with NXP innovative RF cooking components and Midea’s heritage of creating a more comfortable lifestyle for people, the new appliance delivers an ideal balance of quality, precision and performance. With the appliance, consumers can enjoy perfectly heated food within minutes.
The secret to efficient and effective heating, delivered by the Midea appliance, is NXP’s MHT1004N, a low-voltage solid state cooking transistor which creates and delivers energy in an effective and efficient way. The component enables greater control over the heating process and allows the Midea appliance to control energy in a closed loop manner for evenly heated food. The semiconductor cooking method also enables consistent results thereby enabling smart features for internet-connected appliances.
“We’re excited to team up with NXP and transform the conventional methods of cooking to solid state,” said Luan Chun, director of the appliances business unit innovation center at Midea. “Together, we’ve also jointly developed a standard system unit, which enables us to quickly implement new designs using a flexible, modular approach for future product developments.”
“Midea and NXP have been cooperating for years to research and develop solutions for the future smart kitchen,” said Mr. Wu Dong, senior director of RF products at NXP Semiconductors Asia Pacific. “This new appliance calls upon our years of collaborating and innovating together with the same vision — to usher in a smarter cooking experience into consumers’ kitchens.”